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KX023-1025
Tri-Axis, User Selectable ± 2g, 4g, 8g, Digital (I²C/SPI) Output, Integrated FIFO/FILO buffer, 3x3x0.9mm LGA - KX023-1025

The KX023 is a robust, low-power, I2C/SPI, 3-axis accelerometer with integrated FIFO/FILO buffer that features a wide range of embedded functionality, including tap detection, orientation, activity, and wake-up algorithms. Kionix’s XAC sensor provides outstanding stability with a market-leading combination of improved shock, reflow, and thermal performance. The KX023 also offers accelerometer outputs with up to 16-bit resolution for greater precision. User-selectable parameters include ± 2g, 4g or 8g ranges and Output Data Rates (ODR) with programmable high-pass and low-pass filters. It is packaged in a 16-pin, 3x3x0.9mm LGA plastic package.

Highlights

  • Low current consumption
  • Embedded FIFO/FILO Buffer
  • Two interrupts
  • User-configurable, embedded wake-up function to conserve battery power
  • Internal voltage regulator
  • Available in a 12-pin, 2x2x0.9mm package

Related Products

Product Specifications

Axis G Range Sensitivity Noise (µg/√Hz) Resolution Package Size Pins Package Type Interface Output Wakeup Operating Temperature (Min.)[°C] Operating Temperature (Max.)[°C] Supply Voltage [V] Current Consumption
3 2g, 4g, 8g, User-selectable 16384, 8192, 4096 (16-bit), (counts/g) 100 8-bit, 16-bit 3x3x0.9mm 16-pin LGA Digital SPI/I²C Yes -40 85 1.71-3.6 10-145 μA

EVALUATION BOARDS

PART NUMBER BUY NOW DESCRIPTION DOCUMENTATION
EVAL-KX023-1025 Cart KX023-1025 Evaluation Board Board Layout
Board Schematic

Developer Tools

Buy Now Description
IoT Evaluation and Development Kit Cart Kionix's IoT evaluation kit utilizes hardware platform based on Nordic Semiconductor's Bluetooth LE SoC. The compact (27/32mm x 4.2mm), highly integrated modular sensor system integrates Kionix's accelerometer (KX122-1037), combo accel-mag (KMX62-1031), and combo accel-gyro (KXG07) sensors along with ROHM's barometric pressure sensor (BM1383AGLV). Additional sensors can be evaluated using the add-on board that can fit inside the kit. This enables measurement of 3D acceleration, 3D magnetism, 3D rotation, air pressure, and temperature, making it ideal for training, prototyping, and initial set development of IoT and wearable applications.