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KXCJ9-1008
Tri-Axis, User Selectable ± 2g, 4g, 8g, 16g Digital (I²C) Output, 3x3x0.9mm LGA - KXCJ9-1008

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The KXCJ9 is a high-performance, ultra-low-power, tri-axis accelerometer designed for mobile applications. It offers our best power performance along with an embedded wake-up feature, Fast-mode I²C and up to 14-bit resolution. The KXCJ9 is delivered in a 3 x 3 x 0.9 mm, 10-pin, LGA package with an operating temperature range of -40°C to +85°C. The KXCJ9 sensor offers improved shock, reflow, and temperature performance, and the ASIC has internal voltage regulators that allow operation from 1.8 V to 3.6 V within the specified product performance. Pin compatible with KXTI9 and KXTF9.

FlexSet™ Performance Optimization

Highlights

  • Excellent Thermal Performance
  • Extremely low power plus embedded wake-up feature
  • Industry-leading stability
  • Internal Voltage regulator
  • KXCJ9-1018 offers up to 16g range
  • Pin compatible with KXTI9 and KXTF9
FlexSet™ Performance Optimization

Product Specifications

Axis G Range Sensitivity Noise (µg/√Hz) Resolution Package Size Pins Package Type Interface Output Wakeup Operating Temperature (Min.)[°C] Operating Temperature (Max.)[°C] Supply Voltage [V] Current Consumption
3 2g, 4g, 8g, User-selectable 1024 (14-bit), 64, 32, 16 (8-bit), 1024, 512, 256 (12-bit), (counts/g) - 8-bit, 12-bit, 14-bit 3x3x0.9mm 10-pin LGA Digital (I²C) Yes -40 85 1.8-3.6 10-135 μA

EVALUATION BOARDS

PART NUMBER BUY NOW DESCRIPTION DOCUMENTATION
EVAL-KXCJ9-1008 Cart KXCJ9-1008 Evaluation Board Board Schematic
Board Layout

Developer Tools

Buy Now Description
IoT Evaluation and Development Kit Cart Kionix's IoT evaluation kit utilizes hardware platform based on Nordic Semiconductor's Bluetooth LE SoC. The compact (27/32mm x 4.2mm), highly integrated modular sensor system integrates Kionix's accelerometer (KX122-1037), combo accel-mag (KMX62-1031), and combo accel-gyro (KXG07) sensors along with ROHM's barometric pressure sensor (BM1383AGLV). Additional sensors can be evaluated using the add-on board that can fit inside the kit. This enables measurement of 3D acceleration, 3D magnetism, 3D rotation, air pressure, and temperature, making it ideal for training, prototyping, and initial set development of IoT and wearable applications.